Copper Bonding Wire advantage
1) Low cost,
For 1.00 mile bonding wire, cost can be cut down maximum 75%, two mile cost down can reach 90%
2) Low Resistance
Copper wire has good electric conductivity, Its resistance is 1.6μΩ/cm,conductivity is is 1.6μΩ/cm, 33% highier than gold.
3）Hight Thermal Conductivity, The thermal conductivity is 20% highier than gold, so the thermal can be dispensed effectively from the encapsulation,so the bonding wire can be cooling down and stress can be released quickly.
4) Intermetallic compound growth is slow: copper wire mechanical performance is stable, and resistance increase is low, and IMC growth is small, so the bonding intensity would be promoted.
Specifications:
Diameter | Mil | 0.8 | 0.86 | 1.0 | 1.1 | 1.2 | 1.5 | 1.6 | 2.0 |
μm | 20 | 22 | 25 | 28 | 30 | 38 | 42 | 50 |
Cu | Elongation(%) | 8-14 | 10-15 | 10-16 | 11-18 | 12-20 | 12-20 | 12-22 | 12-25 |
Fracture Load(g) | 6-10 | 8-13 | 9-15 | 10-20 | 12-22 | 18-30 | 30-40 | 40-55 |
Φ0.7-Φ2.0 mil bonding wire made of Single Crystal Copper
Packing: across, Paraelleled rolling, ,
Length:200m or 500mm,
Storage time:25℃, Humidity:25-50%RH
the detail specification of Our single crystal copper bonding wire
1) HV hardness
55～65 HV
2) Elongation
15 μm：6～12%，25 um：12～18%，50 um：15～25%
3) Tensile strength
15 μm：4～9g，25 um：10～15g，50 um：40～55g
4) Electrical resistance
1.717～1.673×10-8Ω·m
5) Impurity level, including oxygen in ppm purity
Copper≥99.99%，oxygen≤2ppm
Our single crystal copper bonding wire predominance:
1. Prevention of chip damage
2. Stable 2nd-bonding
3. Higher electrical conductivity
